杂志简称：ieee t semiconduct m
中文译名：《ieee半导体制造汇刊》
收录属性：scie（2024版）, 目次收录（维普）, 目次收录（超星）,英文期刊,
自引率：17.50%
投稿方向：工程技术、engineering, electrical & electronic工程、电子与电气、physics, applied物理、应用、physics, condensed matter物理、凝聚态物理、engineering, manufacturing工程、制造
SCI/E期刊基本信息
出版周期：季刊 地区：美国
中科院分区：3区
是否TOP：非TOP期刊
是否综述：非综述期刊
是否OA：非OA期刊
国际标准刊号：ISSN 0894-6507；EISSN 1558-2345
杂志语言：英语
出版国家：美国
杂志官网 联系方式
出版地址：IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC,445 HOES LANE,PISCATAWAY,USA,NJ,08855-4141
杂志邮箱：
投稿网址：https://mc.manuscriptcentral.com/tsm-ieee
杂志官方网址：https://eds.ieee.org/publications/transactions-on-semiconductor-manufacturing
出版商网址：http://www.ieee.org
杂志投稿要求
投稿须知【杂志社官方网站信息】
INFORMATION FOR AUTHORS
CONTENT
The IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING publishes the latest advances related to the manufacture of microelectronic and photonic components and integrated systems, including photovoltaic devices and micro-electro-mechanical systems. Its principal aim is to continually enhance the knowledge base and improve manufacturing practice across the entire supply chain from fabrication to delivery of these devices. Areas of interest include process integration, manufacturing equipment performance and modeling, yield analysis and enhancement, metrology, process control,material handling, factory systems and all areas of factory and supply chain management related to the semiconductor industry including materials synthesis, equipment manufacturing, and mask making. Papers submitted to this journal should have a clear relevance to manufacturing practice, as opposed to device design and device characterization.
Particularly sought for these TRANSACTIONS are original papers describing practical engineering techniques for solving problems involving interactions among facility, equipment, process, product, and people issues in the context of manufacturing. The TRANSACTIONS’ spectrum of coverage will range from fundamental to applied. Whenever possible papers should include appropriate results from manufacturing experience. Submission of a manuscript manifests the fact that it has been neither copyrighted, published, nor submitted or accepted for publication elsewhere, unless otherwise so stated by the author.
The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A) (https://pspb.ieee.org/images/files/files/opsmanual.pdf). Each published article is reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs (https://open.ieee.org/index.php/about-ieee-openaccess/faqs/#waivers).
LENGTH
The standard length for regular papers is eight published pages. Longer manuscripts may be considered, but page charges of $175 per page will be assessed for each page beyond 8 pages. The Transactions also publishes short communications in the form of Letters, at most three pages in length, which present specific technical contributions of limited scope that may be of interest to the readership but are not sufficient to merit publication as a full paper. Hence, author(s) are encouraged to provide the most value per page by presenting their work as compactly as possible without being telegraphic or incomplete. Each paper must include an abstract of no more than 200 words. Author biographies and photos should not be included.
STYLE FOR MANUSCRIPTS
Authors should submit their manuscripts in the two column format using the IEEE template style. The font sizes and line spacing must not be altered when using the template. The template and further guidelines on the preparation of manuscripts can be obtained from the IEEE Tools for Authors web site at https://journals.ieeeauthorcenter.ieee.org/. In addition, guidelines on how to write for technical periodicals can be found at https://www.ieee.org/content/ieee-org/en/publications/. A cover letter stating explicitly that the manuscript is being submitted for publication in the IEEE Transactions on Semiconductor Manufacturing and is not under consideration by another journal must accompany the manuscript. T-SM will no longer publish photos and bios, please do not include them in your submission.