杂志简称：j electron packaging
中文译名：《电子封装杂志》
收录属性：scie（2024版）, 目次收录（维普）, 目次收录（知网）,英文期刊,
自引率：17.10%
投稿方向：工程技术、engineering, mechanical工程、机械、engineering, electrical & electronic工程、电子与电气
SCI/E期刊基本信息
出版周期：季刊 地区：美国
中科院分区：3区
是否TOP：非TOP期刊
是否综述：非综述期刊
是否OA：非OA期刊
国际标准刊号：ISSN 1043-7398；EISSN 1528-9044
杂志语言：英语
出版国家：美国
杂志官网 联系方式
出版地址：ASME-AMER SOC MECHANICAL ENG,THREE PARK AVE,NEW YORK,USA,NY,10016-5990
杂志邮箱：
投稿网址：https://journaltool.asme.org/home/index.cfm
杂志官方网址：https://asmedigitalcollection.asme.org/electronicpackaging
出版商网址：http://www.asme.org
杂志投稿要求
期刊信息【杂志社官方网站信息】
About the Journal
Purpose
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems
Diversity and Inclusion The Technical Committee on Publications and Communications endorses the commitment of ASME to support diversity and to create and ensure inclusive and ethical practices for publishing as well as the science and engineering professions.
Frequency: Quarterly
Information for Authors
ASME Journal Information for Authors
Comprehensive information and instructions for prospective ASME authors
投稿须知：
https://www.asme.org/publications-submissions/journals/information-for-authors